THICK ON-CHIP HIGH-PERFORMANCE WIRING STRUCTURES

摘要

Methods for fabricating a back-end-of-line (BEOL) wiring structure, BEOL wiring structures (10), and design structures for a BEOL wiring structure. The BEOL wiring may be fabricated by forming a first wire (44, 45) in a dielectric layer (18) and annealing the first wire in an oxygen- free atmosphere. After the first wire is annealed, a second wire (60, 61) is formed in vertical alignment with the first wire. A final passivation layer (74), which is comprised of an organic material such as polyimide, is formed that covers an entirety of a sidewall of the second wire.