| 摘要 |
<p>A lead (16) of an electronic component (10) is connected to a pad (24) of a substrate (20), and a solder layer (30) is correspondingly provided in a gap (G) defined between an exposed surface (14a) of a support member (14) which is a conductor, set to current-less ground potential, of the electronic component and an upper surface (22a) of a ground layer (22) of the substrate. The volume of the solder layer (30) is set to be equal to or smaller than a volume of the gap (G).</p> |
