发明名称 FILM-FORMING RADIATION-CROSSLINKING ADHESIVE
摘要 Radiation-crosslinkable hot-melt adhesives containing more than 50% of polyurethane polymers which contain at least one radiation-polymerizable reactive group. The radiation-crosslinkable hot-melt adhesive is prepared by reacting a) a reactive PU prepolymer having a particular block structure b) 20 to 95 mol % of at least one low-molecular-weight compound (B) containing a radically polymerizable double bond and a group reacting with an NCO group; c) 0 to 50 mol % of at least one compound (C) having at least one group reactive to NCO groups but no group that is polymerizable under radical conditions, with a molar mass of 32 to 5000 g/mol; d) 5 to 50 mol % of at least one radical photoinitiator (D) having a primary or secondary OH group, as well as optionally further polymers and/or auxiliary substances. The adhesives can be cured for bonding nonwoven substrates or for coating labels, tapes, films and plasters with pressure-sensitive adhesive coatings.
申请公布号 KR20130070598(A) 申请公布日期 2013.06.27
申请号 KR20127029474 申请日期 2011.04.11
申请人 HENKEL AG & CO. KGAA 发明人 LACK MELANIE;MOELLER THOMAS;KRLEJOVA ANDREA
分类号 C09J175/14;C08G18/67;C08G18/75;C08L75/14 主分类号 C09J175/14
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