| 发明名称 |
Semiconductor component including a semiconductor chip and a passive component |
| 摘要 |
A semiconductor component includes a semiconductor chip, and a passive component, with the semiconductor component including a coil as the passive component. The semiconductor chip and the passive component are embedded in a plastic encapsulation compound with connection elements to external contacts.
|
| 申请公布号 |
US8471393(B2) |
申请公布日期 |
2013.06.25 |
| 申请号 |
US20060614579 |
申请日期 |
2006.12.21 |
| 申请人 |
MEYER THORSTEN;WAIDHAS BERND;BRUNNBAUER MARKUS;SOMMER GRIT;WAGNER THOMAS;INFINEON TECHNOLOGIES AG |
发明人 |
MEYER THORSTEN;WAIDHAS BERND;BRUNNBAUER MARKUS;SOMMER GRIT;WAGNER THOMAS |
| 分类号 |
H01L23/522 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
