发明名称 MANUFACTURING METHOD OF MULTILAYER POLYIMIDE FLEXIBLE METAL-CLAD LAMINATE
摘要 Provided is a multilayer polyimide flexible metal-clad laminate where multiple layers of polyimide are structured on one surface or two surfaces of a metal foil, the multilayer polyimide flexible metal-clad laminate including: multiple layers of polyimide having different coefficients of linear thermal expansion; and gradient layers each formed between polyimide layers of the multiple layers of polyimide, the gradient layer having a gradual change in coefficient of linear thermal expansion between the polyimide layers, and a manufacturing method thereof, so that there can be provided a flexible metal-clad laminate for a printed circuit board capable of solving a delamination problem between the polyimide layers and having excellent dimensional stability.
申请公布号 US2013149515(A1) 申请公布日期 2013.06.13
申请号 US201213706479 申请日期 2012.12.06
申请人 SK INNOVATION CO., LTD.;SK INNOVATION CO., LTD. 发明人 JO BYOUNG WOOK;KIM YOUNG DO;KOOK SEUNG JEONG
分类号 H05K1/03 主分类号 H05K1/03
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