TAPING UNIT, ELECTRONIC COMPONENT HOUSING METHOD, AND ELECTRONIC COMPONENT INSPECTION DEVICE

摘要

Provided is a taping unit the efficiently detects and removes defective electronic components. The taping unit (1) houses an electronic component (D) on a carrier tape (T) having a plurality of housing sections (U) lined up in the longitudinal direction, and transfers the electronic component along a transfer path; and the electronic component is housed therein, in a housing section (U) at a first position (P1) upon the transfer path (12), and is transferred by a transfer means (10). An imaging means (20) captures an image of the electronic component (D) that has been transferred to a second position (P2) on the downstream side of the first position in the transfer direction. A defect detection means (30) detects defects in the electronic component (D) from the imaging results. An electronic component (D) having a defect detected therein is removed from the housing section (U) by a removal means (40). The removal means (40) is moved relative to the carrier tape (T) by a travel mechanism (50), and positioned at the second position (P2).