发明名称 HOUSING AND METHOD FOR MAKING HOUSING
摘要 A housing of an electronic device is provided, which includes a plastic substrate defining a through hole having an inner wall, and an antenna formed on a surface of the plastic substrate. A conductive element is formed on the inner wall of the substrate through hole to electronically connect to the antenna. The conductive element defines a hole. The conductive element hole is filled with solidified poly-putty base.
申请公布号 US2013141885(A1) 申请公布日期 2013.06.06
申请号 US201213488944 申请日期 2012.06.05
申请人 GU CHANG-HAI;ZHANG JIAN-PING;XIA HOU-EN;FIH (HONG KONG) LIMITED;SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. 发明人 GU CHANG-HAI;ZHANG JIAN-PING;XIA HOU-EN
分类号 H05K7/06;B05D3/00;B05D5/12 主分类号 H05K7/06
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