发明名称 |
HOUSING AND METHOD FOR MAKING HOUSING |
摘要 |
A housing of an electronic device is provided, which includes a plastic substrate defining a through hole having an inner wall, and an antenna formed on a surface of the plastic substrate. A conductive element is formed on the inner wall of the substrate through hole to electronically connect to the antenna. The conductive element defines a hole. The conductive element hole is filled with solidified poly-putty base.
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申请公布号 |
US2013141885(A1) |
申请公布日期 |
2013.06.06 |
申请号 |
US201213488944 |
申请日期 |
2012.06.05 |
申请人 |
GU CHANG-HAI;ZHANG JIAN-PING;XIA HOU-EN;FIH (HONG KONG) LIMITED;SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. |
发明人 |
GU CHANG-HAI;ZHANG JIAN-PING;XIA HOU-EN |
分类号 |
H05K7/06;B05D3/00;B05D5/12 |
主分类号 |
H05K7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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