| 发明名称 |
SEMICONDUCTOR LASER DEVICE ASSEMBLY |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a current-injection semiconductor laser device assembly having a configuration and structure which can output ultrashort pulse laser beams. <P>SOLUTION: The semiconductor laser device assembly comprises (A) a current-injection mode-locked semiconductor laser element 10 having an optical density of 10 GW/cm<SP POS="POST">2</SP>or greater and a carrier density of 1×10<SP POS="POST">19</SP>/cm<SP POS="POST">3</SP>or greater, and (B) a dispersion compensation optical system 110 which receives and emits laser beams emitted from the mode-locked semiconductor laser element 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013105813(A) |
申请公布日期 |
2013.05.30 |
| 申请号 |
JP20110247276 |
申请日期 |
2011.11.11 |
| 申请人 |
SONY CORP |
发明人 |
KONO SHUNSUKE;KURAMOTO MASARU;MIYAJIMA TAKAO;KODA RINTARO;WATANABE HIDEKI |
| 分类号 |
H01S5/065;H01S5/14;H01S5/323 |
主分类号 |
H01S5/065 |
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