发明名称 ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material excellent in adhesive strength between an FPC and an electrode, specifically excellent in adhesive strength between an FPC and a metal electrode. <P>SOLUTION: In an anisotropic conductive material containing a binder resin, a conductive particle and a solvent, the binder resin has an urethane skeleton including a carboxyl group. The binder resin preferably obtained by copolymerization of an urethane (meth)acrylate having a carboxyl group. The binder resin further preferably has a weight average molecular weight in a range of 10,000-300,000. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013093244(A) 申请公布日期 2013.05.16
申请号 JP20110235423 申请日期 2011.10.26
申请人 SEKISUI CHEM CO LTD 发明人
分类号 H01B1/20;G06F3/041;H01B5/16;H01L21/60;H01R11/01 主分类号 H01B1/20
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