发明名称 THICK FILM SILVER PASTE AND ITS USE IN MANUFACTURE OF SEMICONDUCTOR DEVICES
摘要 <P>PROBLEM TO BE SOLVED: To provide a thick film silver paste and its use in manufacture of semiconductor devices. <P>SOLUTION: The present invention is directed to an electroconductive silver thick film paste composition comprising Ag, a glass frit and rhodium resinate, Cr<SB POS="POST">2</SB>O<SB POS="POST">3</SB>or a mixture thereof all dispersed in an organic medium. The present invention is further directed to an electrode formed of the paste composition and a semiconductor device, particularly a solar cell, comprising the electrode. The paste is particularly useful for forming a tabbing electrode. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013089600(A) 申请公布日期 2013.05.13
申请号 JP20120230153 申请日期 2012.10.17
申请人 E I DU PONT DE NEMOURS & CO 发明人 HANG KENNETH WARREN;YUCHEN RIN;YUELI WANG
分类号 H01B1/22;H01L31/04 主分类号 H01B1/22
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