| 摘要 |
PURPOSE: A multi chip package is provided to transmit a signal according a chip by using a fluid lens, a lighting part, and a light receiving part and to easily select a semiconductor chip among several semiconductor chips. CONSTITUTION: A semiconductor chip(20) is laminated on a lower substrate(10) with two or more layers. An upper substrate(30) adheres to the upper part of the uppermost semiconductor chip among several semiconductor chips. A light emitting unit(12) is mounted on the lower substrate corresponding to a via hole. A fluid lens(31) adheres to the lower surface of the upper substrate in order to receive a signal from the light emitting unit through the via hole. A light receiving part(22) is formed in the via hole of the semiconductor in order to receive a signal from the fluid lens. |
