发明名称 HEAT SINK
摘要 <P>PROBLEM TO BE SOLVED: To provide a small heat sink which may be mounted in a small area portion on a substrate, has heat radiation effect and electrical insulation properties, and resolves problems of a conventional metal heat sink. <P>SOLUTION: A heat sink 1 is mounted on a circuit board 100 on which an exothermic electronic component 110 is placed and facilitates heat radiation. The heat sink 1 includes: a block shaped body part 10 formed by a resin material having heat radiation and electric insulation properties; and multiple leg parts 20 formed by a plate like high thermal conductivity material. One end of each leg part is buried in the body part 10 so as to be spaced away from the adjacent leg part and the other end of each leg part 20 is formed so as to be placed in contact with the circuit board 100. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013080767(A) 申请公布日期 2013.05.02
申请号 JP20110219017 申请日期 2011.10.03
申请人 RHYTHM KYOSHIN CO LTD 发明人 KITAJIMA YOSHIICHI;HATAKEYAMA TOSHIHIRO
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
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