Chip card with sealed antenna winding, chip and carrier foils

摘要

Chip card has antenna winding (A) on an inside antenna carrier foil (HM), which has a recess (CA) to take the chip (C), which is connected with antenna winding terminals (A1, A2) by wiring traces (L1, L2) over a chip carrier foil (HCT). The entire array is enclosed between inner and top layers (N11, N12, HD1, HD2). The novel features are that (1) the inner layers (N11, N12) have a m.pt. >= 20 K below that of the top layers (HD1, HD2), the antenna carrier foil (HM) and the chip carrier foil (HCT); and (2) the top layers (HD1, HD2) and adjacent inner layers (N11, N12) consist of composite materials (DF1, DF2) and these composite materials (DF1, DF2) are vacuum pressed at a temperature between the softening temperatures of the layers with low and high m.pt. so that they enclose all the other components mentioned. Also claimed are: (a) a method of producing the chip card; and (b) the antenna and chip carrier foils (HM, HCT). Preferably at least one of the top layers (HD1, HD2) is printed or coated with a printed film. The chip (C) is cemented to the chip carrier foil (HCT) and connected with wiring traces (L1, L2) by chip bonding through first holes, whilst the antenna terminals (A1, A2) are welded or soldered with wiring traces (L1, L2) through second holes (TO1, TO2) in the chip carrier foil (HCT). The chip (C) is coated with a protective drop (CC) of highly insulating plastics. The antenna winding (A) is produced by etching a metal layer on the antenna carrier layer (HM) or by cementing a wire winding.