SEMI CONDUCTOR PACKAGE AND METHOD FOR INSPECTING THE SAME

摘要

PURPOSE: A semiconductor package and an inspecting method thereof are provided to easily inspect a bonding failure of a solder ball by coating the lower side of a semiconductor chip boned to a PCB with fluorescent substances. CONSTITUTION: A semiconductor chip(110) is mounted on a substrate(120). A plurality of solder balls(140) are electrically connected to the semiconductor chip. The solder ball is formed on the lower side of the substrate. A molding unit(150) covers the semiconductor chip and the substrate. Fluorescent substances(160) are coated on the lower side of the substrate. The fluorescent materials are coated around the plurality of solder balls.