| 摘要 |
FIELD: electricity.SUBSTANCE: system to attach a semiconductor crystal to a body base comprises a silicon crystal and a copper body, between which a buffer element is installed to form a soldered seam, at the same time the buffer element is made in the form of a net, the lower side of which represents a set of wires from copper and is arranged in the grooves of the body base. Copper wires are placed in the grooves of the body base, onto which the diamond powder is applied, the total area of diamond grains on each wire makes around 50% of its surface, and to bind diamond grains with the wire, a metal or an alloy is used, which is a coating of the body base, at the same time diamond grains protrude by 20-25 mcm above the body base, and soldering is carried out by application of ultrasonic or low-frequency oscillations to the crystal, which are directed along the grooves in the body.EFFECT: reduction of dry joints in a soldered seam and improved heat removal from a crystal to a body.2 dwg |
