DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITORS, AND FILM CAPACITOR

摘要

Provided is a dielectric resin composition for film capacitors that have high withstand voltage, high heat resistance and low dielectric loss. This dielectric resin composition for film capacitors is a mixture which contains an organic material (A) and an organic material (B). The organic material (A) is configured of at least two organic material components (A1, A2) which respectively have a reactive group (for example, OH or NCO) crosslinkable with each other. The organic material (B) does not have a reactive moiety that is reactive with the organic material (A) and has a dielectric loss (tandelta) at 125°C of 0.3% or less. It is preferable that both of the organic material (A) and the organic material (B) have an aromatic ring (R). The glass transition temperature of the mixture is 130°C or more, and preferably 280°C or less. This dielectric resin composition is capable of increasing heat resistance and dielectric breakdown strength, and is also capable of decreasing dielectric loss.