发明名称 COOLER FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE
摘要 <p>Provided is a cooler for a semiconductor module in which it is possible to eliminate an increase in temperature in some semiconductor elements only and to cool the semiconductor elements in a uniform and stable manner. The cooler for a semiconductor module feeds a coolant from the exterior to a water jacket (2A) and cools semiconductor elements disposed on the outer surface thereof. An intake port (24) and an outlet port (25) are disposed on the left side wall (2Ab) of the water jacket (2A). An intake port section (21a) and an outlet port section (22a) both protrude from the same left side wall (2Ab). A flow speed adjustment plate (28) is disposed, parallel to a fin (2C), on a coolant outlet channel (22) which is a second channel disposed parallel to, and at a distance from, a coolant intake channel (21) which is a first channel. Using the pressure generated when the coolant collides with the flow speed adjustment plate (28) makes it possible for the fin (2C) to adjust the flow speed distribution.</p>
申请公布号 WO2013054887(A1) 申请公布日期 2013.04.18
申请号 WO2012JP76453 申请日期 2012.10.12
申请人 FUJI ELECTRIC CO., LTD. 发明人 ICHIMURA, TAKESHI;GOHARA, HIROMICHI;MOROZUMI, AKIRA
分类号 H01L23/473;H02M7/48;H05K7/20 主分类号 H01L23/473
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