发明名称 THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermally conductive sheet excellent in both adhesiveness and thermal conductivity in an orthogonal direction relative to the thickness direction thereof, and a method for manufacturing the thermally conductive sheet. <P>SOLUTION: A thermally conductive sheet 1 has a peeling adhesive force to copper foil of 2 N/10 mm or more, a thermal conductivity TC1 in the thickness direction TD of 4 W/m K or more, a thermal conductivity TC2 in the plane direction PD of 20 W/m K or more, and a ratio (TC2/TC1) of the thermal conductivity TC2 in the plane direction PD relative to the thermal conductivity TC1 in the thickness direction TD is 3 or more. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013062379(A) 申请公布日期 2013.04.04
申请号 JP20110199910 申请日期 2011.09.13
申请人 NITTO DENKO CORP 发明人 FUKUZAKI SAORI;HIRANO KEISUKE;IZUMITANI SEIJI
分类号 H01L23/373;H05K7/20 主分类号 H01L23/373
代理机构 代理人
主权项
地址