| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce electric resistance in an interlayer connection part and thereby enabling a flexible wiring board to be applied for use involving large current. <P>SOLUTION: A flexible wiring board includes: an insulation film 10; a first metal layer 21 and a second metal layer 42 which are respectively formed on both surfaces of the insulation film 10; a via hole 30 penetrating through the insulation film 10 and the first metal layer 21; and an interlayer connection part 50v which is formed in the via hole 30 and electrically connects the first metal layer 21 with the second metal layer 42. The thickness of the first metal layer 21 is 0.08 mm or thicker, and a diameter of the via hole 30 is 0.1 mm or larger. The interlayer connection part 50v is formed by a plating part 50 filling the via hole 30 so as to fill the via hole 30. <P>COPYRIGHT: (C)2013,JPO&INPIT |
