发明名称 REPLACEMENT GATE SEMICONDUCTOR DEVICE
摘要 A method for fabricating a semiconductor device including providing a semiconductor substrate having a first opening and second opening. A dielectric layer is formed on the substrate. An etch stop layer on the dielectric layer in the first opening. Thereafter, a work function layer is formed on the etch stop layer and fill metal is provided on the work function layer to fill the first opening.
申请公布号 US2013075827(A1) 申请公布日期 2013.03.28
申请号 US201113245581 申请日期 2011.09.26
申请人 LEE DA-YUAN;HSU KUANG-YUAN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,("TSMC") 发明人 LEE DA-YUAN;HSU KUANG-YUAN
分类号 H01L21/336;B82Y99/00;H01L21/28;H01L27/092 主分类号 H01L21/336
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