发明名称 |
IN-SITU BACKSIDE CLEANING OF SEMICONDUCTOR SUBSTRATE |
摘要 |
The present disclosure provides a method and apparatus for cleaning a semiconductor wafer. In an embodiment of the method, a single wafer cleaning apparatus is provided and a wafer is positioned in the apparatus. A first chemical spray is dispensed onto a front surface of the wafer. A back surface of the wafer is cleaned while dispensing the first chemical spray. The cleaning of the back surface may include a brush and spray of cleaning fluids. An apparatus operable to clean the front surface and the back surface of a single semiconductor wafer is also described.
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申请公布号 |
US2013074872(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
US201113240583 |
申请日期 |
2011.09.22 |
申请人 |
YEH MING-HSI;CHUANG KUO-SHENG;CHIEN YING-HSUEH CHANG;YANG CHI-MING;LIN CHIN-HSIANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,("TSMC") |
发明人 |
YEH MING-HSI;CHUANG KUO-SHENG;CHIEN YING-HSUEH CHANG;YANG CHI-MING;LIN CHIN-HSIANG |
分类号 |
B08B3/08;B08B1/00;B08B3/02;B08B7/04 |
主分类号 |
B08B3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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