发明名称 ETCHANT FOR COPPER AND COPPER ALLOY
摘要 <P>PROBLEM TO BE SOLVED: To provide a stable and long-life etchant composition which is superior in practicability and which enables the etching of a metal multilayer film pattern including a copper layer, a copper oxide layer and/or a copper alloy layer with good accuracy, and allows the formation of good sectional shape, and to provide an etching method with the etchant composition. <P>SOLUTION: The etchant composition is used for etching a metal multilayer film having a copper layer, a copper oxide layer and/or a copper alloy layer. The etchant composition comprises: 0.1-80 wt.% of persulfate and/or persulfuric acid solution; 0.1-80 wt.% of phosphoric acid; and 0.1-50 wt.% of nitric acid and/or sulfuric acid. Adding chloride ions or ammonium ions to the etchant composition, it becomes possible to easily control the etching rate and the sectional shape. Also, the invention relates to an etching method using the etchant composition. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013058629(A) 申请公布日期 2013.03.28
申请号 JP20110196394 申请日期 2011.09.08
申请人 KANTO CHEM CO INC 发明人 TAKAHASHI HIDEKI
分类号 H01L21/308;C23F1/18;H01L21/306;H01L21/3205;H01L21/3213;H01L21/336;H01L21/768;H01L23/532;H01L29/786 主分类号 H01L21/308
代理机构 代理人
主权项
地址