| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an attachment structure of a heat sink which is easily attached to an accurate position and improves the package density. <P>SOLUTION: An attachment structure of a heat sink 130, cooling an electronic component 120 disposed on a printed substrate 110, includes: multiple strut parts 140 erected on the printed substrate 110; and a beam part 150 spanning a space between the strut parts 140. The beam part 150 has suspending parts 154 which suspend and position the heat sink 130. <P>COPYRIGHT: (C)2013,JPO&INPIT |
