| 摘要 |
A heat sink assembly (216) includes a heat sink (218) having an upper surface (220), a lower surface (222), a non-metal-core circuit board (224) disposed in register with the upper surface (220), and at least one solid state electronic component (SSEC) (226) electrically coupled to the circuit board (224) such that an underside (228) of each SSEC (226) is not in confronting relationship with the circuit board (224). A first thermal interface material (232) is disposed between and thermally coupled to the underside (228) of the SSEC (226) and the upper surface (220), the first thermal interface material (232) being electrically and thermally conductive. A second thermal interface material (236) is disposed in thermal communication with the lower surface (222) and spreads heat to the second heat sink (104), the second thermal interface material (236) being electrically insulating and thermally conductive.
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