PACKAGE SUBSTRATE AND MANUFACTURING METHOD OF PACKAGE

摘要

PURPOSE: A package substrate and a manufacturing method thereof are provided to reduce the number of reflow processes by forming a post bump on a substrate using solder paste melt. CONSTITUTION: A connection pad(140) and a seed layer(150) are formed on the upper side of a substrate(130). The substrate is one of a circuit board, a semiconductor wafer, or an electronic device. A post bump(100) includes a metal post(110) and a solder bump(120). The metal post is formed on the seed layer with one pillar type. The solder bump surrounds both sides of the metal post. The metal post is made of copper.