| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency module capable of easily measuring a mounting state by detecting relative positions of circuits on a high-frequency circuit chip and circuits on a wiring board constituting the module, and an inspection method of the high-frequency module. <P>SOLUTION: A high frequency module comprises a high-frequency circuit chip 1 with an input-output terminal 6 and a wiring board 2 with a wiring unit including a connection pad 7 which flip-chip connects the input-output terminal 6 via a bump 5. This frequency module further comprises a spiral inductor 3s connected between two input-output terminals and a detection conductor 4d arranged in a position facing the spiral inductor 3s and connected to a ground potential. This module can measure a change in the distance between the input-output terminal 6 and the connection pad 7 caused by a change in the distance between the spiral inductor 3s and the detection conductor 4d by measuring the inductance between connection pads. <P>COPYRIGHT: (C)2013,JPO&INPIT |
