| 摘要 |
PURPOSE: A chip embedded printed circuit board and a manufacturing method thereof are provided to improve elasticity by using a core layer made of polyethylene naphthalate or polyimide. CONSTITUTION: A first and a second bonding layer(122,124) are formed at both side of an insulating layer(110). A cavity is formed at the insulating layer, the first and the second bonding layer. A circuit pattern layer(132) is adjacent to the first and the second bonding layer. An electric component or a chip is mounted in the cavity. .
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