| 摘要 |
Wafer sort data can be converted to binary data, whereby each integrated circuit of the wafer is assigned a value of one or zero, depending on whether test data indicates the integrated circuit complies with a specification. In addition, each integrated circuit is assigned position data to indicate its position on the wafer. A frequency transform, such as a multidimensional discrete Fourier transform (DFT), is applied to the binary wafer sort data and position data to determine a spatial frequency spectrum that indicates error patterns for the wafer. The spatial frequency spectrum can be analyzed to determine the characteristics of the wafer formation process that resulted in the errors, and the wafer formation process can be modified to reduce or eliminate the errors. |
