SEMICONDUCTOR MODULE AND INVERTER MOUNTING THE SAME

摘要

PROBLEM TO BE SOLVED: To achieve wiring inductance reduction (noise reduction) of a semiconductor module.

SOLUTION: A semiconductor module 200 comprises: a substrate 40; and a substrate 44 arranged opposed to the substrate 40. An emitter electrode E10 of a semiconductor element 10 is provided to face a side of the substrate 44 and electrically connected to a wiring layer 54e. A collector electrode C11 of a semiconductor element 11 is provided to face a side of the substrate 40 and electrically connected to the wiring layer 54e via a heat spreader 64. A passive element 70 and a control circuit element 80 are provided on the substrate 44 including the wiring layer 54e to which an emitter electrode E10 of the semiconductor element 10 as a control target is electrically connected. A passive element 74 and a control circuit element 84 are provided on the substrate 40 including a wiring layer 50c to which an emitter electrode E11 of the semiconductor element 11 as a control target is electrically connected.

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