发明名称 Method of bonding porous metal to metal substrates
摘要 A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.
申请公布号 US8383033(B2) 申请公布日期 2013.02.26
申请号 US20090575998 申请日期 2009.10.08
申请人 BIOMET MANUFACTURING CORP.;GUPTA GAUTAM 发明人 GUPTA GAUTAM
分类号 B22F7/04 主分类号 B22F7/04
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