发明名称 Methods Of Processing Substrates
摘要 A method of processing a substrate includes forming first photoresist on a substrate. A portion of the first photoresist is selectively exposed to actinic energy and then the first photoresist is negative tone developed to remove an unexposed portion of the first photoresist. Second photoresist is formed on the substrate over the developed first photoresist. A portion of the second photoresist is selectively exposed to actinic energy and then the second photoresist is negative tone developed to remove an unexposed portion of the second photoresist and form a pattern on the substrate which comprises the developed first photoresist and the developed second photoresist. Other implementations are disclosed.
申请公布号 US2013040245(A1) 申请公布日期 2013.02.14
申请号 US201113205004 申请日期 2011.08.08
申请人 LIGHT SCOTT L.;JAIN KAVERI;ZHANG ZISHU;DE VILLIERS ANTON J.;MILLWARD DAN;ZHOU JIANMING;HYATT MICHAEL D. 发明人 LIGHT SCOTT L.;JAIN KAVERI;ZHANG ZISHU;DE VILLIERS ANTON J.;MILLWARD DAN;ZHOU JIANMING;HYATT MICHAEL D.
分类号 G03F7/20 主分类号 G03F7/20
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