| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multi-piece wiring board capable of efficiently manufacturing a multi-piece wiring board which allows manufacturing a semiconductor device having a predetermined external dimension at a high yield. <P>SOLUTION: A processing start position of at least a part of a slit 5 is positioned in a discard margin region 4 away from a product region 3. A drill bit B for grinding is inserted in the discard margin region 4 at the processing start position, and the drill bit B is moved while grinding the discard margin region 4 down to a position contacting to the outer periphery of the product region 3. Then, the drill bit B is moved in one direction while grinding the discard margin region 4 along the outer periphery so that the slit is formed with a width corresponding to the diameter of the drill bit B. <P>COPYRIGHT: (C)2013,JPO&INPIT |
