发明名称 ELECTROLESS NICKEL PLATING LIQUID
摘要 <P>PROBLEM TO BE SOLVED: To provide a new electroless nickel plating liquid enabling a nickel plating film having excellent folding resistance to be deposited. <P>SOLUTION: The electroless nickel plating liquid contains an alkylene diamine compound which is expressed by general formula (I). In the formula (I), R<SP POS="POST">1</SP>, R<SP POS="POST">2</SP>, R<SP POS="POST">3</SP>and R<SP POS="POST">4</SP>are identical to or different from one another, and each is a hydrogen atom or a group (in the formula, R<SP POS="POST">5</SP>is a straight-chain or branched-chain alkylene group having carbon atoms of 1-5, and m denotes an integer of 1-10), and n is 2 or 3. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013028866(A) 申请公布日期 2013.02.07
申请号 JP20120219595 申请日期 2012.10.01
申请人 OKUNO CHEMICAL INDUSTRIES CO LTD 发明人 TANABE YASUHIRO;YAMADA YURIKO;SHIMIZU HIROMI
分类号 C23C18/34 主分类号 C23C18/34
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