发明名称 |
THERMAL AND STRESS GRADIENT BASED RC EXTRACTION, TIMING AND POWER ANALYSIS |
摘要 |
<p>Timing, power and SPICE analysis are performed on a circuit layout, based on temperature and stress variations or gradient across the circuit layout. Specifically, the temperature and stress values of individual window locations across the layout are used to obtain temperature and stress variation aware resistance/capacitance (RC), timing, leakage and power values. In addition, in 3D integrated circuits (IC), the stress and thermal variations or gradients of one die may be imported to another die located on a different tier.</p> |
申请公布号 |
WO2013020119(A1) |
申请公布日期 |
2013.02.07 |
申请号 |
WO2012US49660 |
申请日期 |
2012.08.03 |
申请人 |
QUALCOMM INCORPORATED;LIAO, HONGMEI;RADOJCIC, RIKO |
发明人 |
LIAO, HONGMEI;RADOJCIC, RIKO |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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