SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SAME

摘要

[Problem] To provide a semiconductor device having an electrical insulating layer with excellent heat resistance, heat dissipation characteristics, and durability and that can also be fabricated with a process that is highly efficient and has excellent cost characteristics. [Solution] A semiconductor device provided with the following: a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white colored insulating layer that is formed on the first substrate and functions as a reflecting material, wherein the semiconductor chip is an LED, at least the surface of the first substrate is made of metal, and a laminated structure comprising a white colored insulating layer and a metal layer is formed on the surface of the first substrate by applying a liquid material containing SiO2 in the form of nanoparticles and a white inorganic pigment and then firing the liquid material. Preferably, the ratio of SiO2 and white inorganic pigment contained in the aforementioned white insulating layer after firing is 80% by weight or greater.