| 摘要 |
PURPOSE: A braking device of a package facility is provided to prevent the damage of a COB(Chip On Board) chip by fixing the COB chip by vacuum suction. CONSTITUTION: A lower plate(44) includes a protrusion(44a) which corresponds to a cutting groove(104) formed on a COB substrate(100). An insert hole(44b) is formed at the top part of the protrusion. An upper cover plate(42) is moved up and down by a servo motor(46). A vacuum device(48) provides vacuum suction force through the lower plate. A cutter(42a) is installed in the lower part of the upper cover plate. A clamp(200) supports the COB substrate.
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