| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element mounting substrate and a semiconductor device excellent in thermal conductivity and connection reliability and capable of thinning to a higher degree. <P>SOLUTION: A semiconductor element mounting substrate 20 has a semiconductor element mounting member 10 including conductive metal layer patterns 13, 14 and an insulation part 15 on a carrier substrate composed of a detachable base material 11 and an adhesive layer 12, and a reflector 18 on the member 10. The metal layer patterns 13, 14 are covered by the insulation part 15 at least on peripheral edges so as to have exposed parts in portions of the metal layer patterns 13, 14, respectively. The metal layer patterns 13, 14 each has a cross sectional shape such that an outermost peripheral part of each of the metal layer patterns 13, 14 protrudes from a part where the metal layer patterns 13, 14 and the carrier substrate are in contact with each other to the insulation part 15 side when viewed from the side of the metal layer patterns 13, 14 of the member 10. The reflector 18 is arranged in such a manner as not to cover the exposed parts of the metal layer patterns 13, 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
