| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which includes heat sinks arranged on both sides of a first semiconductor element and on both sides of a second semiconductor element, the heat sinks for each semiconductor element being electrically connected via a conductive part, and which can secure appropriate connection by the conductive part. <P>SOLUTION: A semiconductor device includes: a conductive part 90 extending from a second heat sink 20 to a third heat sink 30 side and electrically connecting the second heat sink 20 and the third heat sink 30; and a concavity 100 provided at a connection part of the third heat sink 30 and the conductive part 90 and filled with a conductive adhesive 80, in which a front end side of the conductive part 90 is inserted and connected by the conductive adhesive 80. <P>COPYRIGHT: (C)2013,JPO&INPIT |
