| 摘要 |
A first external connection terminal (14) at a first row (2) is disposed to position at upside of a first I/O cell (12), and a second external connection terminal (15) at a second row (3) is formed at upside of a boundary portion between two adjacent first I/O cells (12). Here, the first external connection terminal (14) and the second external connection terminal (15) are disposed to be separated for a predetermined distance so as not to have an overlapped portion with each other, and formed in an identical layer. According to the constitution, it is possible to prevent disadvantages such as characteristic deterioration of a semiconductor integrated circuit and accuracy deterioration of an electrical inspection while fully securing an electrical connection of probe needles with the first external connection terminal (14) and the second external connection terminal (15) at the electrical inspection time, and enabling higher integration and higher function of a semiconductor chip (1) by shortening a distance between the adjacent first external connection terminal (14) and second external connection terminal (15) at the first row (2) and the second row (3) as much as possible. |
