| 摘要 |
<P>PROBLEM TO BE SOLVED: To inhibit warp or detachment of a flip chip package. <P>SOLUTION: A semiconductor device comprises: a semiconductor chip 300 mounted on a wiring board 100 via bumps 320; and a stiffener 400 provided around the semiconductor chip 300 on the wiring board 100. The stiffener 400 includes: an adhesive part 420 adhered to a circumference of the semiconductor chip 300; and an inclined part at an angle θ of more than 0 degree and less than 90 degrees with respect to a top face of the semiconductor chip 300. <P>COPYRIGHT: (C)2013,JPO&INPIT |
