| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board using a prepreg for a printed wiring board in which the amount of a resin oozing from the prepreg to an inner layer board is small, in molding a multilayer printed wiring board having an inner layer board, such as a rigid-flexible board, protruding therefrom. <P>SOLUTION: A method for manufacturing a multilayer printed wiring board includes the steps of: arranging a prepreg for a printed wiring board on a surface of the printed wiring board; and arranging a metal foil or a metal foil clad laminate on the surface of the prepreg for the printed wiring board, and heating and pressure molding the printed wiring board. At least one or more of the printed wiring boards are larger than the prepreg for the printed wiring board, and the amount of a resin oozing from the prepreg for the printed wiring board is 3 mm or less under heating and pressure molding conditions of 250°C or less and 10 MPa or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
