发明名称 METHOD OF FORMING CONDUCTIVE PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a conductive pattern, that can form the conductive pattern of high definition in which an increase in wiring resistance is sufficiently suppressed. <P>SOLUTION: The method of forming a conductive pattern 10 includes: a releasing agent applying step of applying a releasing agent 44 on an inner wall surface of a recessed groove 42 of an intaglio cylinder 40; a filling step of filling the recessed groove 42 of the intaglio cylinder 40 with a conductive paste 1; a receiving step of making a blanket cylinder 50 receive the conductive paste 41 in the recessed groove 42; and a transfer step of transferring the conductive paste 41 received by the blanket cylinder 50 to a material 20 to be printed. The method of forming the conductive pattern also includes an infrared irradiation step of irradiating the conductive paste 10 in the recessed groove 42 with an infrared ray, between the filling step and the receiving step. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013012510(A) 申请公布日期 2013.01.17
申请号 JP20110142547 申请日期 2011.06.28
申请人 FUJIKURA LTD 发明人 KOSHIMIZU KAZUTOSHI
分类号 H05K3/12;B41M1/10 主分类号 H05K3/12
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