SEMICONDUCTOR PACKAGE FOR VERTICAL ADHESION AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A vertically mounted semiconductor device and a manufacturing method thereof are provided to maintain a vertical state from a mother board by combining a lead exposed on the thickness direction center of molding compound resin with the mother board using solder. CONSTITUTION: A chip mounting plate(12) and multiple leads(14) are parallel to each other. The chip mounting plate is located lower than the leads by downset. A semiconductor chip(20) is attached on one surface of the chip mounting plate. A conductive wire(24) is connected between a bonding pad of the semiconductor chip and the lead. Molding compound resin(26) covers the semiconductor chip, the conductive wire, and the lead. [Reference numerals] (AA) Sewing