METHOD OF IMPROVING THE ADHESION-STRENGTH BETWEEN COPPER CORE AND INSULATING MATERIAL

摘要

PURPOSE: A method for improving adhesion between a copper plate core and an insulating layer is provided to improve adhesion for an insulating layer by forming an electrolytic copper planting layer on the surface of the core and chemically oxidizing the surface. CONSTITUTION: A hole is punched on a rolled copper plate(100). Electrolytic copper planting is performed on the rolled copper plate. An electrolytic copper planting layer(110) is formed on the front surface of the copper plate. An oxide film(120) such as copper oxide is formed on the electrolytic copper planting layer. A resin insulating layer(200) and copper foil(300) are laminated on the oxide film.