发明名称 |
Polishing state monitoring method |
摘要 |
A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.
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申请公布号 |
US8342907(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US20090627333 |
申请日期 |
2009.11.30 |
申请人 |
EBARA CORPORATION;SHIMADZU CORPORATION;KOBAYASHI YOICHI;NAKAI SHUNSUKE;TSUJI HITOSHI;TSUKUDA YASUO;ISHIMOTO JUNKI;SHINYA KAZUNARI |
发明人 |
KOBAYASHI YOICHI;NAKAI SHUNSUKE;TSUJI HITOSHI;TSUKUDA YASUO;ISHIMOTO JUNKI;SHINYA KAZUNARI |
分类号 |
B24B1/00;B24B49/12;B24B37/013;B24B37/04;B24B49/00;B24B49/04;B24B51/00;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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