| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing area array type semiconductors, which can reduce warps and is excellent in reflow resistance and wire sweeping property, and to provide a semiconductor device using the same. <P>SOLUTION: The epoxy resin composition for sealing semiconductors contains a multi-functional epoxy resin having four or more glycidyl ether groups and represented by a specific formula, a phenolic cuing agent (II) (wherein, n is an integer of 1-6), a silane coupling agent (III) (wherein, X is either of N and S elemens; n is an integer of 1-5; m is an integer of 0-2; R<SP POS="POST">1</SP>is H or a 1-8C hydrocarbon group which may have one or more substituents; R<SP POS="POST">2</SP>is methyl or ethyl) as essential elements. The semiconductor device uses the same. <P>COPYRIGHT: (C)2013,JPO&INPIT |
