发明名称 HIGH-SOLID ADHESIVE COMPOSITION
摘要 <p>The present invention addresses the problem of providing a two-pack curable adhesive composition for laminating which can be applied even when having a nonvolatile content of 50 mass% or higher and which has excellent laminating properties. The adhesive composition causes no problem of delamination, etc. when the laminate is subjected to high-temperature sterilization such as boiling or retortion. The two-pack curable adhesive composition for laminating comprises a polyester polyol ingredient as the main component and a polyisocyanate ingredient as a hardener, and is characterized in that the polyester polyol ingredient as the main component was obtained using a polycarboxylic acid or polycarboxylic acid anhydride that contained aromatic rings derived from the orthophthalic acid or phthalic anhydride (OPA) used as a starting material, in an amount of 2.0 mmol or more per g of the solid matter, and that the polyester polyol as the main component has a number-average molecular weight of 4,000 or lower.</p>
申请公布号 WO2012173182(A1) 申请公布日期 2012.12.20
申请号 WO2012JP65227 申请日期 2012.06.14
申请人 DIC GRAPHICS CORPORATION;KIMURA RYOUJI;OSANAI KIYOSHI;HAMASUNA YUTAKA 发明人 KIMURA RYOUJI;OSANAI KIYOSHI;HAMASUNA YUTAKA
分类号 C09J175/06 主分类号 C09J175/06
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