| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for preventing the corrosion of a connecting part and a metalization layer such as a wire bond pad on a sensor, and a manufacturing method thereof. <P>SOLUTION: A device comprises an insulating layer 400 disposed on a metalization layer 300 and an adhering layer 200 disposed on the insulating layer 400. A corrosion resistant layer 100 comprised of gold is disposed on the adhering layer 200. Therefore, while dealing with the use of gold as the corrosion resistant layer 100, a conventional silicon-glass adhering technique can be available. <P>COPYRIGHT: (C)2013,JPO&INPIT |
