发明名称 |
Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same |
摘要 |
The disclosure relates to preparation of silicon on insulator structures with reduced unbonded regions and to methods for producing such wafers by minimizing the roll-off amount (ROA) of the handle and donor wafers. Methods for polishing wafers are also provided. |
申请公布号 |
US8330245(B2) |
申请公布日期 |
2012.12.11 |
申请号 |
US201113021443 |
申请日期 |
2011.02.04 |
申请人 |
PITNEY JOHN A.;YOSHIMURA ICHIRO;FEI LU;MEMC ELECTRONIC MATERIALS, INC. |
发明人 |
PITNEY JOHN A.;YOSHIMURA ICHIRO;FEI LU |
分类号 |
H01L27/12;H01L29/32 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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