发明名称 |
METHOD FOR APPLYING METAL PLATING ONTO RESIN MOLDED ARTICLE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method by which the cost for handling resin molded articles and a number of different molds usually used are drastically reduced and further, the mounting cost of every kind of component is reduced, for applying metal plating onto three dimensional resin molded articles. <P>SOLUTION: A resin molded article 3 is coupled to a flexible carrier 1 by a coupling component 2. The carrier 1 is at the same time used as a conveying tape. The carrier 1 is coupled to both surfaces of each resin molded article 3 so as to temporarily couple a number of resin molded articles 3. In this case, an electrically conductive coupling part is formed. This coupling part is used for energization in the electroplating 8 by the coupling component 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012233258(A) |
申请公布日期 |
2012.11.29 |
申请号 |
JP20120105196 |
申请日期 |
2012.05.02 |
申请人 |
LPKF LASER & ELECTRONICS AG |
发明人 |
LANGE BERND;JOHN WOLFGANG;ROESENER BERND |
分类号 |
C25D17/08;B29C65/00;C25D5/56 |
主分类号 |
C25D17/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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